Item
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Process Capability
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Remarks
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Max. Layers
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16 Layers
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Batch process capability: 1-12 L, Prototype process capability: 1-16 L
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Max. Dimension
|
500*500mm
|
Only allowed to accept 500*500mm temporarily. Exception please contact customer
service
|
Min. Line Width/Space
|
3/3mil
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3/3 mil (finished copper thickness 0.5OZ), 4/4 mil (finished copper thickness
1OZ), 5/5 mil (finished copper thickness 1.5OZ ), 6/6 mil ( finished copper
thickness 2OZ), Suggest increase line width /spacing if condition allow
|
Min. Hole Size (Mechanical drilling)
|
0.25mm
|
Min. aperture of mechanical drilling is 0.25 mm. If conditions allow suggest enlarge
to 0.3 mm or above
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Min. Hole Size (Laser drilling)
|
0.1mm
|
Min. aperture of laser drilling is 0.1 mm. If conditions allow recommend design
to 0.15 mm or above
|
Hole Tolerance (Mechanical drilling)
|
±0.07mm
|
|
Hole Tolerance (Laser drilling)
|
±0.01mm
|
|
Via single-side Annular ring
|
3 mil
|
Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via Annular ring is good
for overcurrent.
|
Effective Circuit bridge
|
6mil
|
Effective Circuit bridge is the connecting line width between two pieces of copper
in the circuit.
|
Finished External Copper Thickness
|
35--70um
|
|
Finished Internal Copper Thickness
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17--35um
|
|
Soldermask Type
|
Photosensitive ink
|
White, Black, Blue, Green, Yellow and Red and so on.
|
Min. Letter Width
|
≥0.15mm
|
If the Min. Letter width is less than 0.15mm, the letters on the boards may not
be clear because of design.
|
Min. Letter Height
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≥1mm
|
If the Min. Letter height is less than 1mm, the letters on the boards may not be
clear because of design.
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Letter Aspect Ratio
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1:05
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The more suitable the Aspect Ratio is, the more convenient for fabrication is.
|
Surface Treatment
|
|
HASL, HASL Leadfree, ENIG and OSP(for mass production)
|
Board Thickness Range
|
0.4—3.0mm
|
Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, 3.0mm for mass production
|
Board Thickness Tolerance
|
± 10%
|
|
Min. Slot Mill
|
0.65mm
|
|
Space between Routing and Outline
|
≥0.25mm(10mil)
|
Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is 0.8mm.
|
Min. Half-hole
|
0.6mm
|
Half-hole is a special technology.
|
Array Space (without gap)
|
0
|
|
Array Space (with gap)
|
1.6mm
|
The gap should not less than 1.6mm. Otherwise, it would be difficuit for routing.
|
Peel Strength
|
≥2.0N/cm
|
|
Flammability
|
94V-0
|
|
Impedance control Tolerance
|
土10%
|
|
Pads Manufacturer Copper Pour Type
|
Hatch
|
Manufacturers adopt Hatch to pour copper. The customers use Pads design PCB please
do pay attention to this item.
|
Draw Slot in Pads Software
|
Use Drill Drawing Layer
|
If there are many non-metallic chemical slots on the boards, please draw on the
Drill Drawing Layer
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Solder-mask Open layer in Protel/dxp software
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Solder Layer
|
Few engineers mistakenly put this into paste layer. While Kiki PCB would not
deal with paste layer.
|
Protel /dxp Outline Layer
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Use Keepout Layer or Machanical Layer
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Please note: there are only one outline layer allowed in one file, two outline layers
is not permitted. Please remove the useless outline layer. That’s to say, just choose
either Keepout Layer or Machanical Layer to draw outline.
|
Special Surface Treatment
|
Solder mask is green ink as usual said. Kiki PCB can not do S/M Bridge temporarily.
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Material Type
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FR - 4, High-frequency plate, Rogers, FR4 double-sided PCB boards are made
from A-class Jiantao material and the Multilayers boards are from Shengyi Material.
|