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Item Process Capability Remarks
Max. Layers 16 Layers Batch process capability: 1-12 L,
Prototype process capability: 1-16 L
Max. Dimension 500*500mm Only allowed to accept 500*500mm temporarily. Exception please contact customer service
Min. Line Width/Space 3/3mil 3/3 mil (finished copper thickness 0.5OZ),
4/4 mil (finished copper thickness 1OZ),
5/5 mil (finished copper thickness 1.5OZ ),
6/6 mil ( finished copper thickness 2OZ),
Suggest increase line width /spacing if condition allow
Min. Hole Size (Mechanical drilling) 0.25mm Min. aperture of mechanical drilling is 0.25 mm. If conditions allow suggest enlarge to 0.3 mm or above
Min. Hole Size (Laser drilling) 0.1mm Min. aperture of laser drilling is 0.1 mm. If conditions allow recommend design to 0.15 mm or above
Hole Tolerance (Mechanical drilling) ±0.07mm
Hole Tolerance (Laser drilling) ±0.01mm
Via single-side Annular ring 3 mil Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via Annular ring is good for overcurrent.
Effective Circuit bridge 6mil Effective Circuit bridge is the connecting line width between two pieces of copper in the circuit.
Finished External Copper Thickness 35--70um
Finished Internal Copper Thickness 17--35um
Soldermask Type Photosensitive ink White, Black, Blue, Green, Yellow and Red and so on.
Min. Letter Width ≥0.15mm If the Min. Letter width is less than 0.15mm, the letters on the boards may not be clear because of design.
Min. Letter Height ≥1mm If the Min. Letter height is less than 1mm, the letters on the boards may not be clear because of design.
Letter Aspect Ratio 1:05 The more suitable the Aspect Ratio is, the more convenient for fabrication is.
Surface Treatment HASL, HASL Leadfree, ENIG and OSP(for mass production)
Board Thickness Range 0.4—3.0mm Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, 3.0mm for mass production
Board Thickness Tolerance ± 10%
Min. Slot Mill 0.65mm
Space between Routing and Outline ≥0.25mm(10mil) Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is 0.8mm.
Min. Half-hole 0.6mm Half-hole is a special technology.
Array Space (without gap) 0
Array Space (with gap) 1.6mm The gap should not less than 1.6mm. Otherwise, it would be difficuit for routing.
Peel Strength ≥2.0N/cm
Flammability 94V-0
Impedance control Tolerance 土10%
Pads Manufacturer Copper Pour Type Hatch Manufacturers adopt Hatch to pour copper. The customers use Pads design PCB please do pay attention to this item.
Draw Slot in Pads Software Use Drill Drawing Layer If there are many non-metallic chemical slots on the boards, please draw on the Drill Drawing Layer
Solder-mask Open layer in Protel/dxp software Solder Layer Few engineers mistakenly put this into paste layer. While Kiki PCB would not deal with paste layer.
Protel /dxp Outline Layer Use Keepout Layer or Machanical Layer Please note: there are only one outline layer allowed in one file, two outline layers is not permitted. Please remove the useless outline layer. That’s to say, just choose either Keepout Layer or Machanical Layer to draw outline.
Special Surface Treatment Solder mask is green ink as usual said. Kiki PCB can not do S/M Bridge temporarily.
Material Type FR - 4, High-frequency plate, Rogers, FR4 double-sided PCB boards are made from A-class Jiantao material and the Multilayers boards are from Shengyi Material.