Item	Process Capability	Remarks
Max. Layers	16 Layers	Batch process capability: 1-12 L, Prototype process capability: 1-16 L
Max. Dimension	500*500mm	Only allowed to accept 500*500mm temporarily. Exception please contact customer service
Min. Line Width/Space	3/3mil	3/3 mil (finished copper thickness 0.5OZ), 4/4 mil (finished copper thickness 1OZ), 5/5 mil (finished copper thickness 1.5OZ ), 6/6 mil ( finished copper thickness 2OZ), Suggest increase line width /spacing if condition allow
Min. Hole Size (Mechanical drilling)	0.25mm	Min. aperture of mechanical drilling is 0.25 mm. If conditions allow suggest enlarge to 0.3 mm or above
Min. Hole Size (Laser drilling)	0.1mm	Min. aperture of laser drilling is 0.1 mm. If conditions allow recommend design to 0.15 mm or above
Hole Tolerance (Mechanical drilling)	±0.07mm
Hole Tolerance (Laser drilling)	±0.01mm
Via single-side Annular ring	3 mil	Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via Annular ring is good for overcurrent.
Effective Circuit bridge	6mil	Effective Circuit bridge is the connecting line width between two pieces of copper in the circuit.
Finished External Copper Thickness	35--70um
Finished Internal Copper Thickness	17--35um
Soldermask Type	Photosensitive ink	White, Black, Blue, Green, Yellow and Red and so on.
Min. Letter Width	≥0.15mm	If the Min. Letter width is less than 0.15mm, the letters on the boards may not be clear because of design.
Min. Letter Height	≥1mm	If the Min. Letter height is less than 1mm, the letters on the boards may not be clear because of design.
Letter Aspect Ratio	1:05	The more suitable the Aspect Ratio is, the more convenient for fabrication is.
Surface Treatment		HASL, HASL Leadfree, ENIG and OSP(for mass production)
Board Thickness Range	0.4—3.0mm	Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, 3.0mm for mass production
Board Thickness Tolerance	± 10%
Min. Slot Mill	0.65mm
Space between Routing and Outline	≥0.25mm(10mil)	Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is 0.8mm.
Min. Half-hole	0.6mm	Half-hole is a special technology.
Array Space (without gap)	0
Array Space (with gap)	1.6mm	The gap should not less than 1.6mm. Otherwise, it would be difficuit for routing.
Peel Strength	≥2.0N/cm
Flammability	94V-0
Impedance control Tolerance	土10%
Pads Manufacturer Copper Pour Type	Hatch	Manufacturers adopt Hatch to pour copper. The customers use Pads design PCB please do pay attention to this item.
Draw Slot in Pads Software	Use Drill Drawing Layer	If there are many non-metallic chemical slots on the boards, please draw on the Drill Drawing Layer
Solder-mask Open layer in Protel/dxp software	Solder Layer	Few engineers mistakenly put this into paste layer. While Kiki PCB would not deal with paste layer.
Protel /dxp Outline Layer	Use Keepout Layer or Machanical Layer	Please note: there are only one outline layer allowed in one file, two outline layers is not permitted. Please remove the useless outline layer. That’s to say, just choose either Keepout Layer or Machanical Layer to draw outline.
Special Surface Treatment	Solder mask is green ink as usual said. Kiki PCB can not do S/M Bridge temporarily.
Material Type	FR - 4, High-frequency plate, Rogers, FR4 double-sided PCB boards are made from A-class Jiantao material and the Multilayers boards are from Shengyi Material.

Item

Process Capability

Remarks

Max. Layers

16 Layers

Batch process capability: 1-12 L,
Prototype process capability: 1-16 L

Max. Dimension

500*500mm

Only allowed to accept 500*500mm temporarily. Exception please contact customer service

Min. Line Width/Space

3/3mil

3/3 mil (finished copper thickness 0.5OZ),
4/4 mil (finished copper thickness 1OZ),
5/5 mil (finished copper thickness 1.5OZ ),
6/6 mil ( finished copper thickness 2OZ),
Suggest increase line width /spacing if condition allow

Min. Hole Size (Mechanical drilling)

0.25mm

Min. aperture of mechanical drilling is 0.25 mm. If conditions allow suggest enlarge to 0.3 mm or above

Min. Hole Size (Laser drilling)

0.1mm

Min. aperture of laser drilling is 0.1 mm. If conditions allow recommend design to 0.15 mm or above

Hole Tolerance (Mechanical drilling)

±0.07mm

Hole Tolerance (Laser drilling)

±0.01mm

Via single-side Annular ring

3 mil

Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via Annular ring is good for overcurrent.

Effective Circuit bridge

6mil

Effective Circuit bridge is the connecting line width between two pieces of copper in the circuit.

Finished External Copper Thickness

35--70um

Finished Internal Copper Thickness

17--35um

Soldermask Type

Photosensitive ink

White, Black, Blue, Green, Yellow and Red and so on.

Min. Letter Width

≥0.15mm

If the Min. Letter width is less than 0.15mm, the letters on the boards may not be clear because of design.

Min. Letter Height

≥1mm

If the Min. Letter height is less than 1mm, the letters on the boards may not be clear because of design.

Letter Aspect Ratio

1:05

The more suitable the Aspect Ratio is, the more convenient for fabrication is.

Surface Treatment

HASL, HASL Leadfree, ENIG and OSP(for mass production)

Board Thickness Range

0.4—3.0mm

Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, 3.0mm for mass production

Board Thickness Tolerance

± 10%

Min. Slot Mill

0.65mm

Space between Routing and Outline

≥0.25mm(10mil)

Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is 0.8mm.

Min. Half-hole

0.6mm

Half-hole is a special technology.

Array Space (without gap)

Array Space (with gap)

1.6mm

The gap should not less than 1.6mm. Otherwise, it would be difficuit for routing.

Peel Strength

≥2.0N/cm

Flammability

94V-0

Impedance control Tolerance

土10%

Pads Manufacturer Copper Pour Type

Hatch

Manufacturers adopt Hatch to pour copper. The customers use Pads design PCB please do pay attention to this item.

Draw Slot in Pads Software

Use Drill Drawing Layer

If there are many non-metallic chemical slots on the boards, please draw on the Drill Drawing Layer

Solder-mask Open layer in Protel/dxp software

Solder Layer

Few engineers mistakenly put this into paste layer. While Kiki PCB would not deal with paste layer.

Protel /dxp Outline Layer

Use Keepout Layer or Machanical Layer

Please note: there are only one outline layer allowed in one file, two outline layers is not permitted. Please remove the useless outline layer. That’s to say, just choose either Keepout Layer or Machanical Layer to draw outline.

Special Surface Treatment

Solder mask is green ink as usual said. Kiki PCB can not do S/M Bridge temporarily.

Material Type

FR - 4, High-frequency plate, Rogers, FR4 double-sided PCB boards are made from A-class Jiantao material and the Multilayers boards are from Shengyi Material.

Capabilities